HFCL, MediaTek partner to help Indian telcos address last-mile 5G connectivity
HFCL Limited, in collaboration with chip-maker MediaTek, unveils its 5G FWA Indoor CPE with the aim to address last-mile connectivity challenges faced by telecom operators. The partnership was announced at ‘MWC 2024’ in Barcelona, Spain.
The HFCL 5G FWA Indoor CPE, powered by MediaTek T750 chipset, offers an ultra-compact form factor and minimal power consumption. It features a 5G radio, quad-core Arm CPU, and dual-band 4×4 Wi-Fi 6 support for seamless connectivity across multiple devices.
Mahendra Nahata, Managing Director of HFCL, highlighted that the 5G solution provides a fibre-like experience to consumers and enterprises. With a 2.5 Gbps Ethernet interface for high-speed data transfer and embedded eSIM, the device aims to revolutionize last-mile connectivity.
Evan Su, General Manager of Wireless Communications at MediaTek, emphasized that the partnership supports the Indian government’s vision of promoting local manufacturing in the telecom sector. The modem’s functionality enables device makers to create efficient yet high-performance CPE products.
The global 5G last-mile equipment market is anticipated to reach $68 billion by 2030, according to industry estimates. The collaboration between HFCL and MediaTek is a significant step towards achieving the government’s goal of creating a sustainable telecom ecosystem.
